Remote I/O.
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Built for Zonal Architecture and Remote I/O
Zonal architectures are reshaping vehicle electronics by organizing systems into local zones, which helps reduce wiring and improve integration. Remote I/O chips play a key role in this setup by connecting sensors and actuators to processing units, managing data flow within each zone. Automotive OEMs and Tier 1 suppliers need proven, ready-to-use silicon platforms to support this transition while keeping development time and complexity in check.
Platform for Custom Automotive Silicon
ChipFlow’s Automotive Remote I/O reference design is built to support your development needs directly. It delivers a complete, pre-verified design with all essential digital and analog IP blocks, ready for you to customize. This platform gives your engineering team a reliable foundation to build on, helping you accelerate development while meeting automotive-grade standards. It also aligns with your software-defined vehicle strategy, making silicon integration more straightforward and scalable.
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Discover ChipFlow’s Automotive 130nm reference platform — a flexible, pre-integrated silicon platform tailored for remote I/O applications across automotive and industrial IoT domains. Designed to accelerate custom ASIC development, this platform includes:
Core Digital IPs: 10BASE-T1S Ethernet MAC+PHY, UART/I2C/SPI, RISC-V core, interconnect fabric, watchdog and general-purpose timers, GPIO, SPI Flash, and more.
Analog Components: Bandgap, LDO, power-on reset, ADC, PLL, and temperature sensors.
Optional Add-ons: MACSEC, Hardware IEEE 1722 parsing, CAN-FD, sensor fusion, OTA update support, and analog features like HS drivers and LIN/CAN-FD PHYs.
System Capabilities: Focus on low power, testability, 80–100 pin package guidance, and analog performance.
Compliance & Integration: Targets automotive-grade reliability (~125°C), regulatory compliance, and modular system design principles.
Ideal for OEMs seeking rapid, configurable ASIC solutions. Read our blog for more info!